Quick prototyping of flip chip assembly with MEMS

Publisher Website

27 November 2002

proceedings article
Published by Institute of Electrical and Electronics Engineers (IEEE)

p. 293-296
https://doi.org/10.1109/rawcon.1998.709194

Abstract

No abstract available

Keywords

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Batch transfer of microstructures using flip-chip solder bump bonding
Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002