Batch transfer of microstructures using flip-chip solder bump bonding
- 22 November 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 1, 265-268
- https://doi.org/10.1109/sensor.1997.613634
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- Angular micropositioner for disk drivesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Smart MEMS: flip chip integration of MEMS and electronicsPublished by SPIE-Intl Soc Optical Eng ,1995
- GaAs MQW modulators integrated with silicon CMOSIEEE Photonics Technology Letters, 1995