Evaluation of reliability of μBGA solder joints through twisting and bending

• 1 March 1999
• journal article
• Published by Elsevier in Microelectronics Reliability
• Vol. 39  (3) , 391-399
• https://doi.org/10.1016/s0026-2714(98)00212-1

Abstract

Keywords

• ΜBGA SOLDER JOINTS
• MECHANICAL RELIABILITY
• BENDING AND TWISTING OF PCBS
• WEIBULL MODELING