Packaging Technology for Josephson Integrated Circuits
- 1 June 1982
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 5 (2) , 271-280
- https://doi.org/10.1109/tchmt.1982.1135958
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
- Controlled Collapse Reflow for Josephson Chip BondingJournal of the Electrochemical Society, 1982
- Pluggable Connectors for Josephson ComputersIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1982
- A Josephson technology system level experimentIEEE Electron Device Letters, 1981
- Summary Abstract: Thin film and package processing aspects of Josephson LSIJournal of Vacuum Science and Technology, 1981
- The Superconducting ComputerScientific American, 1980
- An Overview of Josephson PackagingIBM Journal of Research and Development, 1980
- Coming in SpectrumIEEE Spectrum, 1979
- Obtaining Gas Panel Metallization Patterns by Vacuum Deposition Through Rib-supported Mask StructuresIBM Journal of Research and Development, 1978