An improved numerical method for predicting intermetallic layer thickness developed during the formation of solder joints on Cu substrates
- 1 November 1999
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 28 (11) , 1194-1202
- https://doi.org/10.1007/s11664-999-0157-0
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Theory for intermetallic phase growth between cu and liquid Sn-Pb solder based on grain boundary diffusion controlJournal of Electronic Materials, 1998
- A numerical method for predicting intermetallic layer thickness developed during the formation of solder jointsJournal of Electronic Materials, 1996
- A study of solute diffusion in liquid tinActa Metallurgica, 1960