Measurement, modeling, and simulation of flip-chip CMOS ASIC simultaneous switching noise on a multilayer ceramic BGA
- 1 January 1997
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
- Vol. 20 (3) , 266-271
- https://doi.org/10.1109/96.618226
Abstract
No abstract availableKeywords
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