Rigorous electromagnetic modeling of chip-to-package (first-level) interconnections
- 1 January 1993
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 16 (8) , 876-883
- https://doi.org/10.1109/33.273688
Abstract
No abstract availableThis publication has 7 references indexed in Scilit:
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