Effects of Ambient Gas on the Out-Diffusion of Nickel and Copper through Thin Gold Films
- 1 January 1985
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Reduced Cu-Cr mixing and reduced Pt-Cu interdiffusion by oxygen in Cu/Cr and Pt/Cu/Cr thin filmsJournal of Applied Physics, 1982
- The Thin-Film Module as a High-Performance Semiconductor PackageIBM Journal of Research and Development, 1982
- The reduction of Au—Al intermetallic formation and electromigration in hydrogen environmentsIEEE Transactions on Electron Devices, 1979
- LOW-TEMPERATURE MIGRATION OF SILICON IN THIN LAYERS OF GOLD AND PLATINUMApplied Physics Letters, 1971