Optical Proximity Communication in packaged SiPhotonics
- 1 January 2008
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
We report 10Gb/s optical-proximity-communication with reflecting mirrors micro-machined into Si and co-integrated to low loss SOI waveguides for chip to chip communication using a self-aligned-packaging mechanism with measured 4.0 dB coupling loss.Keywords
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