Thermodynamic considerations in the thick-film metallization of aluminium nitride substrates
- 1 January 1990
- journal article
- research article
- Published by Springer Nature in Journal of Materials Science Letters
- Vol. 9 (1) , 91-93
- https://doi.org/10.1007/bf00722881
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- Adherence-fracture energy of a glass-bonded thick-film conductor: effect of firing conditionsJournal of Materials Science, 1977
- Adhesion, phase morphology, and bondability of reacttvely-bonded and frit-bonded gold and silver thick-film conductorsJournal of Electronic Materials, 1974