Device fabrication by nanolithography and electroplating for magnetic flux quantization measurements
- 15 May 1984
- journal article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 44 (10) , 1011-1013
- https://doi.org/10.1063/1.94602
Abstract
100-keV e-beam lithography and electroplating of gold have been used to fabricate a device for the measurement of quantum changes in magnetic flux. The structure is defined in a 200-nm-thick layer of a copolymer of methyl methacrylate and methacrylic acid (PMMA/MAA) on top of a Si wafer covered by 150 nm of Si3N4. The device is a square frame of 2×2 μm2 and 100-nm linewidth. Gold was electroplated to a thickness of 100 nm. This technique allows the fabrication of high resolution, high aspect ratio gold structures.Keywords
This publication has 5 references indexed in Scilit:
- A field emission e-beam system for nanometer lithographyJournal of Vacuum Science & Technology B, 1983
- Fabrication of submicrometer gold lines using optical lithography and high-growth-rate electroplatingIEEE Electron Device Letters, 1983
- Low noise niobium dc SQUID with a planar input coilApplied Physics Letters, 1983
- Gold transmission gratings with submicrometer periods and thicknesses ≳0.5 μmJournal of Vacuum Science and Technology, 1981
- Resolution, overlay, and field size for lithography systemsIEEE Transactions on Electron Devices, 1981