Assembling three-dimensional microstructures using gold-silicon eutectic bonding
- 31 December 1994
- journal article
- Published by Elsevier in Sensors and Actuators A: Physical
- Vol. 45 (3) , 227-236
- https://doi.org/10.1016/0924-4247(94)00836-1
Abstract
No abstract availableThis publication has 11 references indexed in Scilit:
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