Silicon-to-silicon anodic bonding with a borosilicate glass layer
- 1 September 1991
- journal article
- Published by IOP Publishing in Journal of Micromechanics and Microengineering
- Vol. 1 (3) , 139-144
- https://doi.org/10.1088/0960-1317/1/3/002
Abstract
Anodic bonding of silicon wafers by sputter deposited glass films, silicon-to-silicon anodic bonding, is presented as a promising sealing method in microengineering. A reliable process for wafer-to-wafer bonding is described and data concerning yield and bonding strength are given. Cathodic bonding is reported in a discussion about the bonding mechanism. Different sputter deposited and annealed Pyrex 7740 layers are evaluated as sealing material. Some advantages of silicon-to-silicon anodic bonding as a mounting method for micromechanical sensors are quantified.Keywords
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