Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications
- 1 December 1999
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components and Packaging Technologies
- Vol. 22 (4) , 575-581
- https://doi.org/10.1109/6144.814974
Abstract
No abstract availableThis publication has 6 references indexed in Scilit:
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- Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applicationsIEEE Transactions on Components and Packaging Technologies, 1999
- Conductive adhesives for high-frequency applicationsIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1998
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- Interconnection line structures on MCM-Si for giga-hertz quasi-TEM signal transmissionPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1998
- An accurate equivalent circuit model of flip chip and via interconnectsIEEE Transactions on Microwave Theory and Techniques, 1996