Conductive adhesives for high-frequency applications
- 1 January 1998
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
- Vol. 21 (3) , 469-477
- https://doi.org/10.1109/95.725211
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Electro-thermo-mechanical responses of conductive adhesive materialsIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1997
- Attenuation in silver-filled conductive epoxy interconnectsIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1997
- Electrical conduction models for isotropically conductive adhesive jointsIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1997
- On the failure mechanism of anisotropically conductive adhesive joints on copper metallisationInternational Journal of Adhesion and Adhesives, 1996
- Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substratesIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1996