Attenuation in silver-filled conductive epoxy interconnects
- 1 March 1997
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
- Vol. 20 (1) , 52-59
- https://doi.org/10.1109/95.558544
Abstract
No abstract availableKeywords
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