Micropelt miniaturized thermoelectric devices: small size, high cooling power densities, short response time

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Abstract
Thermoelectric thin film micro-devices, especially high cooling power density Peltier coolers, are of high demand for e.g. chip hot spot cooling, life science applications, telecommunication purposes or self-standing and -powered sensor systems. Obviously, such applications stand for industrial high volume quantities of reliable products. Thus a manufacturing is required using technologies similar to typical processes used for microelectronics fabrication. The above mentioned key drivers for emerging markets are applications around ambient temperatures. Thus, since the discovery in the 1950's, the bismuth telluride (V-VI) related compounds are favoured. Consistent with those conditions the Micropelt concept for thermoelectric devices with typical thin film thermoelectric layers in common vertical architecture on silicon substrates were successfully invented and developed. Here, we will summarize the technological steps and present the state-of-the-art of the development of those Micropelt devices. The properties of Micropelt devices including their material properties, cooling performance and response time will be reported. Results of a new method for chemical gas analysis in the field of laser spectroscopy, which needs as prerequisite the fast response time of Micropelt devices, will be shown.

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