Thermal Studies of a Plastic Dual-in-Line Package
- 1 December 1979
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 2 (4) , 500-511
- https://doi.org/10.1109/tchmt.1979.1135483
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
- Scanning Infrared Microscopy Techniques for Semiconductor Thermal Analysis8th Reliability Physics Symposium, 1979
- Thermal Conductivity Enhancement of Epoxies by the use of FillersIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1978
- Thermal Design in a Hybrid System with High Packing DensityIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1978
- The thermal conductivity of epoxy-resin / powder composite materialsJournal of Physics D: Applied Physics, 1974
- The Thermal and Electrical Conductivity of Two-Phase SystemsIndustrial & Engineering Chemistry Fundamentals, 1974
- Thermal Chip Evaluation of IC PackagingIEEE Transactions on Parts, Hybrids, and Packaging, 1972
- The Analysis of Data from Accelerated Stress Tests8th Reliability Physics Symposium, 1971
- Thermal Conductivity of Heterogeneous Two-Component SystemsIndustrial & Engineering Chemistry Fundamentals, 1962