Bulk micromachined relay with lateral contact
- 13 June 2000
- journal article
- Published by IOP Publishing in Journal of Micromechanics and Microengineering
- Vol. 10 (3) , 329-333
- https://doi.org/10.1088/0960-1317/10/3/305
Abstract
A bulk micromachined relay has been developed with silicon-glass wafer bonding and deep reactive ion etch technologies. The microrelay has a lateral contact structure, and it is laterally driven by electrostatic actuators. The processing is very simple, and only two masks are used. To fulfill different demands, we designed various structures of the microrelay including sizes, contact structures and actuating structures. The mechanical structures are made by single-crystal silicon, which has perfect mechanical performance. Using sputtered gold as contact materials, the measured contact is below 1 Ω.Keywords
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