Microsystem packaging: lessons from conventional low cost IC packaging

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Abstract
This paper describes some of the issues associated with the packaging of microsystems and how packaging can influence their reliability and performance. The importance of early consideration in the design cycle of packaging, and the environment in which the microsystem will be placed, is stressed. It illustrates how the IC packaging industry has striven to overcome the problems of residual stress, stress minimization, hermeticity, and improved thermal performance in their packages and how this can be applied to microsystem packaging. Packaging problems specific to microsystems are identified.

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