Thermal-mechanical enhanced high-performance silicone gels and elastomeric encapsulants in microelectronic packaging
- 1 June 1995
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
- Vol. 18 (2) , 270-273
- https://doi.org/10.1109/95.390302
Abstract
No abstract availableKeywords
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