Electrical performance and reaction kinetics of silicone gels

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Abstract
Silicone gels are becoming more accepted as protective coatings for Very Large Scale Integrated circuits (VLSI) against severe environments due to their excellent electrical, thermal, and mechanical properties. Recent studies indicate that high performance silicone gels in low-cost, non-hermetic plastic packaging may replace conventional hermetic ceramic packaging. This paper describes the use of the soft silicone gels as coatings on Integrated Circuit (IC) devices, and the correlation between the material's cure temperature and cure time versus their adhesion and electrical reliability during 85°C, 85% RH and bias accelerating testing. In addition, the reaction kinetics of the silicone gel based on the Differential Scanning Calorimetry (DSC) study of the uncured sample will be reported.

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