A New Silicone Gel Sealing Mechanism for High Reliability Encapsulation
- 1 September 1984
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 7 (3) , 249-256
- https://doi.org/10.1109/tchmt.1984.1136362
Abstract
No abstract availableThis publication has 1 reference indexed in Scilit:
- Humidity Test of Premolded Chip CarriersIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1981