The performance choice: a study of chip and package densities
- 4 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 147-151
- https://doi.org/10.1109/ectc.1990.122180
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Package Wiring and TerminalsPublished by Springer Nature ,1989
- A Multilayer Ceramic Multichip ModuleIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1980