X-ray diffraction study of interdiffusion in bimetallic Ag/Cu thin films
- 1 July 1976
- journal article
- research article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 47 (7) , 2857-2861
- https://doi.org/10.1063/1.323061
Abstract
An x-ray diffraction technique recently developed by Houska and co-workers was applied to the problem of measuring interdiffusion at 600°C in 11.2 μ Ag/Cu bimetallic thin films prepared by vapor deposition on mica. The technique consists in matching experimental intensity bands to those calculated from assumed concentration profiles. The profiles which gave best fit in the Ag-rich layer were analyzed by means of a linear diffusion equation solved in a finite region with fixed interface. The value of 1.45×10−12 cm2/sec was obtained for the interdiffusion coefficient in the Ag-rich phase.This publication has 4 references indexed in Scilit:
- X-ray diffraction study of interdiffusion in bimetallic Au/Pd thin filmsJournal of Applied Physics, 1976
- Diffusion coefficient and electromigration velocity of copper in thin silver filmsJournal of Applied Physics, 1974
- Preparation of Thin-Film Diffusion Microcouples in Ternary AlloysJournal of Vacuum Science and Technology, 1973
- X-ray diffraction approach to grain boundary and volume diffusionJournal of Applied Physics, 1973