Numerical stress analysis of resin cracking in LSI plastic packages under temperature cyclic loading
- 1 January 1996
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
- Vol. 19 (3) , 593-600
- https://doi.org/10.1109/96.533901
Abstract
No abstract availableKeywords
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