High-aspect-ratio, ultrathick, negative-tone near-uv photoresist for MEMS applications

Publisher Website

22 November 2002

proceedings article
Published by Institute of Electrical and Electronics Engineers (IEEE)

p. 518-522
https://doi.org/10.1109/memsys.1997.581916

Abstract

No abstract available

Keywords

This publication has 4 references indexed in Scilit:

Sub-micron LIGA process for movable microstructures
Microelectronic Engineering, 1996
Micromachining applications of a high resolution ultrathick photoresist
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 1995
High-aspect-ratio resist for thick-film applications
Published by SPIE-Intl Soc Optical Eng ,1995
Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding (LIGA process)
Microelectronic Engineering, 1986