Abstract
The rate of interface trap Nit build-up after irradiation has been studied in metal-oxide semiconductor oxides which were annealed in either deuterium or hydrogen. The build-up rate is found to be substantially retarded in the deuterium-annealed oxide. This result demonstrates conclusively that the Nit build-up rate is determined by the rate of H+ (D+) drift through the oxide to the Si-SiO2 interface.