High rate deposition of microcrystalline silicon solar cells using 13.56 MHz PECVD
- 1 January 2000
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 150-153
- https://doi.org/10.1109/pvsc.2000.915776
Abstract
In this paper, the authors present microcrystalline silicon (/spl mu/c-Si:H) p-i-n solar cells prepared at high deposition rates using plasma-enhanced chemical vapour deposition (PECVD) at 13.56 MHz excitation frequency. They studied the deposition regime of high RF-power P/sub RF/ (40-100 W for a 150 cm/sup 2/ electrode) and high deposition pressure p/sub dep/ (1-11 Torr) at different silane concentrations and substrate temperatures. In this regime, the prepared i-layers were amorphous or microcrystalline depending on the deposition parameters. The shift between the two growth regimes was achieved by a variation of either deposition pressure, plasma power or silane concentration. The best /spl mu/c-Si:H solar cells were prepared close to the transition to amorphous growth. A high deposition pressure was a prerequisite for obtaining high quality material at a high growth rate. The best solar cell efficiency achieved was 8.0% at 5 /spl Aring//s for a /spl mu/c-Si:H single junction solar cell.Keywords
This publication has 7 references indexed in Scilit:
- High rate growth of microcrystalline silicon at low temperaturesJournal of Non-Crystalline Solids, 2000
- Thin film Si solar cell fabricated at low temperatureJournal of Non-Crystalline Solids, 2000
- Intrinsic microcrystalline silicon: A new material for photovoltaicsSolar Energy Materials and Solar Cells, 2000
- Influence of excitation frequency on plasma parameters and etching characteristics of radio-frequency dischargesSurface and Coatings Technology, 1999
- Microcrystalline silicon and micromorph tandem solar cellsApplied Physics A, 1999
- High Rate Deposition of Microcrystalline Silicon Using Conventional Plasma-Enhanced Chemical Vapor DepositionJapanese Journal of Applied Physics, 1998
- Plasma properties at the transition from remote to direct plasmaSurface and Coatings Technology, 1998