Investigation of Solder Fatigue Acceleration Factors
- 1 June 1985
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 8 (2) , 275-282
- https://doi.org/10.1109/tchmt.1985.1136493
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
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- Experimental constitutive relations for the high temperature deformation of a PbSn eutectic alloyMaterials Science and Engineering, 1981
- Fatigue Behavior of Solders Used in Flip-Chip TechnologyJournal of Testing and Evaluation, 1973
- Reliability of Controlled Collapse InterconnectionsIBM Journal of Research and Development, 1969