Characterization of Thin Dielectric Films as Copper Diffusion Barriers Using Triangular Voltage Sweep
- 1 January 1999
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Passivation effect of silicon nitride against copper diffusionJournal of Applied Physics, 1997
- Diffusion of copper through dielectric films under bias temperature stressThin Solid Films, 1995