Reliability simulator for interconnect and intermetallic contact electromigration
- 4 December 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Projecting interconnect electromigration lifetime for arbitrary current waveformsIEEE Transactions on Electron Devices, 1990
- Electromigration interconnect lifetime under AC and pulse DC stressPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1989
- A model for the width dependence of electromigration lifetimes in aluminum thin-film stripesApplied Physics Letters, 1980
- Dependence of Electromigration-Induced Failure Time on Length and Width of Aluminum Thin-Film ConductorsJournal of Applied Physics, 1970