Reduction of the Kondo temperature in low temperature deposited alloy films of Cu
- 30 June 1976
- journal article
- Published by Elsevier in Solid State Communications
- Vol. 19 (3) , 273-276
- https://doi.org/10.1016/0038-1098(76)90867-x
Abstract
No abstract availableThis publication has 13 references indexed in Scilit:
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