Development of a rapid and automated TEM sample preparation method in semiconductor failure analysis and the study of the relevant TEM artifact
- 1 March 2001
- journal article
- Published by Elsevier in Microelectronics Journal
- Vol. 32 (3) , 221-226
- https://doi.org/10.1016/s0026-2692(00)00124-5
Abstract
No abstract availableKeywords
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- Focused Ion Beam Milling and Micromanipulation Lift-Out for Site Specific Cross-Section Tem Specimen PreparationMRS Proceedings, 1997
- TEM Sample Preparation Using A Focused Ion Beam and A Probe ManipulatorPublished by ASM International ,1996
- Novel scheme for the preparation of transmission electron microscopy specimens with a focused ion beamJournal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 1993