Step-edge fabrication of ultrasmall Josephson microbridges

Abstract
A technique for producing ultrasmall variable‐thickness Josephson microbridges for high‐frequency applications is described. A two‐dimensional shadowing technique is employed with self‐aligning photolithographic and reactive‐ion milling processes to pattern the substrate with high‐resolution steps. Step heights normal to the substrate are used to determine microbridge dimensions. Lead‐alloy microbridges with resistances ≈10 Ω and dimensions of 50 nm have been produced, and their electrical properties studied. The limits on device size are in the range 10–20 nm. Heated‐substrate deposition of high‐Tc superconductors is compatible with this technique.

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