Effect of Excess Temperature above Liquidus of Lead-Free Solders on Wetting Time in a Wetting Balance Test
- 1 January 2001
- journal article
- Published by Japan Institute of Metals in MATERIALS TRANSACTIONS
- Vol. 42 (5) , 745-750
- https://doi.org/10.2320/matertrans.42.745
Abstract
No abstract availableThis publication has 6 references indexed in Scilit:
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