Dispersoid additions to a Pb-free solder for suppression of microstructural coarsening
- 1 August 1994
- journal article
- research article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 23 (8) , 735-739
- https://doi.org/10.1007/bf02651367
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Microstructure and mechanical properties of Sn-In and Sn-Bi soldersJOM, 1993
- The properties of tin-bismuth alloy soldersJOM, 1993
- Composite soldersIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1991