Superplastic creep of low melting point solder joints
- 1 April 1992
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 21 (4) , 401-407
- https://doi.org/10.1007/bf02660403
Abstract
No abstract availableKeywords
This publication has 13 references indexed in Scilit:
- SuperplasticityPublished by Elsevier ,2003
- Superplastic Creep of Eutectic Tin-Lead Solder JointsJournal of Electronic Packaging, 1991
- Superplastic creep of eutectic tinlead solder jointsJournal of Electronic Materials, 1990
- Isothermal Fatigue Behavior of Sn-Pb Solder JointsJournal of Electronic Packaging, 1990
- Deformation Mechanisms in SuperplasticityAnnual Review of Materials Science, 1979
- Flow and Failure of Superplastic MaterialsAnnual Review of Materials Science, 1979
- Review Topics in SuperplasticityPublished by Elsevier ,1975
- Some Observations on the Superplastie Properties of a Bismuth-Indium Eutectic AlloyInternational Journal of Materials Research, 1971
- Superplasticity: A reviewJournal of Materials Science, 1970
- SuperplasticityInternational Materials Reviews, 1970