Solder transfer technique for flip-chip and electronic assembly applications
- 1 July 1998
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C
- Vol. 21 (3) , 182-188
- https://doi.org/10.1109/3476.720415
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Flip-chip replacement within the constraints imposed by multilayer ceramic (MLC) modulesJournal of Electronic Materials, 1984
- Geometric Optimization of Controlled Collapse InterconnectionsIBM Journal of Research and Development, 1969