Adhesive stabilised and pure flip chips on various substrates under thermocycling
- 1 July 1995
- journal article
- research article
- Published by Springer Nature in Microsystem Technologies
- Vol. 1 (3) , 129-136
- https://doi.org/10.1007/bf01294804
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- Reliability of Flip Chip Solder Bump Joints8th Reliability Physics Symposium, 1982