A measurement methodology for laser-based thermal diffusivity measurement of advanced multichip module ceramic materials

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Abstract
Alumina derivative ceramics and Low Temperature Co-fired Ceramic (LTCC) electronic MultiChip Module (MCM) packaging substrates have been thermally, optically and morphologically characterised. This paper focuses on the singleand double-sided inspection laser flash thermal diffusivity measurement techniques used to measure the thermal transport properties of the MCM ceramics, and in particular, on the measurement methodology required to measure the thermal diffusivity of these materials by a single-sided inspection laser flash diffusivity method. The paper highlights problems associated with both the measurement system and associated data analysis for the single-sided measurement and data are compared to those measured by an existing (double sided inspection) standard laser flash method. Finally, a preliminary measurement methodology is proposed.