Realistic electromigration lifetime projection of VLSI interconnects
- 1 December 1994
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 253 (1-2) , 508-512
- https://doi.org/10.1016/0040-6090(94)90375-1
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- Current conduction and reliability implications under current ramping stress of VLSI contactsIEEE Electron Device Letters, 1989
- Activation energy for electrotransport in thin aluminum films by resistance measurementsJournal of Physics and Chemistry of Solids, 1976
- Electromigration—A brief survey and some recent resultsIEEE Transactions on Electron Devices, 1969