On the influence of thermal effects on internal stress measurements during and after deposition of silver, gold and copper films
- 1 July 1985
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 129 (1-2) , 63-70
- https://doi.org/10.1016/0040-6090(85)90095-1
Abstract
No abstract availableThis publication has 7 references indexed in Scilit:
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- The influence of O2, H2, H2O, N2, CO and CH4 on the structure of thin silver films investigated by ultrahigh vacuum internal stress measurementsThin Solid Films, 1982
- Thermal effects during the deposition of thin silver, gold and copper films and their influence on internal stress measurementsThin Solid Films, 1980
- An analysis of the cantilevered plate method of thin film intrinsic stress determinationThin Solid Films, 1980
- Structure and internal stress in ultra-thin silver films deposited on MgF2 and SiO substratesThin Solid Films, 1978
- Recent developments in the study of mechanical properties of thin filmsThin Solid Films, 1972
- The internal stress in evaporated silver and gold filmsThin Solid Films, 1969