Thermal effects during the deposition of thin silver, gold and copper films and their influence on internal stress measurements
- 1 July 1980
- journal article
- research article
- Published by Elsevier in Thin Solid Films
- Vol. 70 (1) , 127-137
- https://doi.org/10.1016/0040-6090(80)90420-4
Abstract
No abstract availableKeywords
This publication has 7 references indexed in Scilit:
- In situ determination of the structure of thin metal films by internal stress measurements: Structure dependence of silver and copper films on oxygen pressure during depositionThin Solid Films, 1980
- Electron microscope structure and internal stress in thin silver and gold films deposited onto MgF2 and SiO substratesThin Solid Films, 1979
- Structure and internal stress in ultra-thin silver films deposited on MgF2 and SiO substratesThin Solid Films, 1978
- Étude de la croissance des couches minces à partir de mesures optiques et électriques pendant leur dépôtThin Solid Films, 1977
- Recent developments in the study of mechanical properties of thin filmsThin Solid Films, 1972
- Stress in silver films deposited at 10-8 torrThin Solid Films, 1970
- The internal stress in evaporated silver and gold filmsThin Solid Films, 1969