60 GHz flip-chip assembled MIC design considering chip-substrate effect
- 22 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 2 (0149645X) , 447-450
- https://doi.org/10.1109/mwsym.1997.602829
Abstract
In this paper, a 60 GHz MICs with flip-chip assembled pseudomorphic-HEMT is demonstrated. With electromagnetic field analysis, the assembly effect was estimated. An amplifier has a gain of 13 dB and a 30/60 GHz frequency doubler has a gain of -3 dB. Measured and simulated results clarify the potential of the structure and design method.Keywords
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