Thermal-mechanical analysis of Terabus high-speed optoelectronic package
- 27 July 2005
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 2, 1854-1858
- https://doi.org/10.1109/ectc.2005.1442049
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
- Parallel optical interconnect at 10 Gb/s per channelPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2004
- Optical interconnects: out of the box forever?IEEE Journal of Selected Topics in Quantum Electronics, 2003
- High-speed high-density parallel free-space optical interconnectionsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Optical interconnection using VCSELs and polymeric waveguide circuitsJournal of Lightwave Technology, 2000
- A comparative study on the thermal characteristics of vertical-cavity surface-emitting lasersJournal of Applied Physics, 1995
- Self-consistent thermal-electrical modeling of proton-implanted top-surface emitting semiconductor lasersPublished by SPIE-Intl Soc Optical Eng ,1994
- Modeling and design of proton-implanted ultralow-threshold vertical-cavity laser diodesIEEE Journal of Quantum Electronics, 1993
- Performance of gain-guided surface emitting lasers with semiconductor distributed Bragg reflectorsIEEE Journal of Quantum Electronics, 1991