Structural study of tin and carbon coimplanted silicon
- 15 June 1991
- journal article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 69 (12) , 8417-8419
- https://doi.org/10.1063/1.347410
Abstract
The alloy system Six(SnyC1−y)1−x was investigated. The purpose is to form material with reduced strain at silicon heterojunctions. In this work, samples were prepared by coimplantation of tin and carbon ions into silicon wafers within the dosage range 1015–1016 cm−2, followed by rapid thermal annealing. Rutherford backscattering and channeling, Auger sputter profiling, and secondary-ion-mass spectrometry were employed to study the crystallinity, chemical composition, and depth profiles. A near-perfect crystallinity for 0.5 at. % of tin and carbon was achieved. For high-dose implanted samples, tin segregation was observed. This work demonstrates promising features of group-IV semiconductor synthesis by ion implantation.This publication has 8 references indexed in Scilit:
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