Board level drop test and simulation of TFBGA packages for telecommunication applications
- 22 June 2004
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 11 (05695503) , 121-129
- https://doi.org/10.1109/ectc.2003.1216266
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applicationsMicroelectronics Reliability, 2003
- Investigating the drop impact of portable electronic productsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Drop/impact simulation and test validation of telecommunication productsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Effect of simulation methodology on solder joint crack growth correlationPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002