Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications
- 1 July 2003
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 43 (7) , 1117-1123
- https://doi.org/10.1016/s0026-2714(03)00127-6
Abstract
No abstract availableThis publication has 7 references indexed in Scilit:
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