Solder joint fatigue models: review and applicability to chip scale packages
Top Cited Papers
- 1 February 2000
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 40 (2) , 231-244
- https://doi.org/10.1016/s0026-2714(99)00061-x
Abstract
No abstract availableKeywords
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